IC Packaging Design, Assembly and Test Services
Available from Tektronix Component Solutions
Tektronix Component Solutions offers turnkey IC packaging services for custom, high-performance microelectronics. This includes a full range of design, lean manufacturing and test services for a variety of applications. Our turnkey services are bolstered by our experience in a variety of package, material, and interconnect technologies including: ball-grid-array (BGA), flip-chip, chip-on-board, chip-on-flex, wire and ribbon bonding, multi-chip modules and more. Additionally, we offer customizable 15 and 20+ GHz BGA and 40 GHz Leadless Chip Carrier (LCC) packaging platforms to meet your wide bandwidth needs.