Remtec designs and manufactures metallized ceramic substrates (Alumina, BeO, and AlN), chip carriers and packages from DC to 40GHz with enhanced thermal management. Leadless SMT chip carriers and packages (hermetic and non hermetic) up to .75” in size for direct PCB mount, use Plated Copper on Thick/Thin Films (PCTF) technology with hermetic (to 10-8) thermal vias (K > 200 W/MoK), wraparounds with low inductance, embedded passives. Typical applications include custom and semi-custom microwave and power components, multichip modules & hybrid circuits: attenuators, filters, RF power amplifiers and LNA’s, mixers, TR modules, and power resistors. Value added service include RF/Microwave modeling, circuit design, test, and assembly services.
We offer design, prototyping and full scale manufacturing for all types of hermetic seals. We specialize in ceramic to metal and sapphire to metal seals. Our products include ceramic packages, optical windows, waveguide components, hermetically sealed brazed or welded components, glass to metal...
MCV-Microwave is a leader in design and manufacture of high performance custom filter solutions for out-of-band emission interference mitigation and 4G and 5G new radio antenna front-end modules. MCV proprietary dielectric resonators exhibit the highest Q x F performance with tight tolerance,...
Anderson & Steinssen, Inc (Abbreviation: ANS), was founded in 2016 and is located in Renton, Washington, USA. Our personnel have more than 20 years’ experience in the chemical industry, working with functional additives, high purity and ultra-pure chemicals, micron and nanomaterials and certain...
