Remtec Inc

Remtec designs and manufactures metallized ceramic substrates (Alumina, BeO, and AlN), chip carriers and packages from DC to 40GHz with enhanced thermal management. Leadless SMT chip carriers and packages (hermetic and non hermetic) up to .75” in size for direct PCB mount, use Plated Copper on Thick/Thin Films (PCTF) technology with hermetic (to 10-8) thermal vias (K > 200 W/MoK), wraparounds with low inductance, embedded passives. Typical applications include custom and semi-custom microwave and power components, multichip modules & hybrid circuits: attenuators, filters, RF power amplifiers and LNA’s, mixers, TR modules, and power resistors. Value added service include RF/Microwave modeling, circuit design, test, and assembly services.