Wireless&RF_TLB_8.1.20

Hermetic Packages

Available from Johanson Manufacturing Corp

Product Details

In its vertically integrated USA facility, Johanson utilizes alumina (AL2O3), aluminum nitride (AlN), beryllium oxide (BeO), Kovar and other materials to produce HTCC multilayer and single layer hermetic & non-hermetic packages in a wide variety of configurations for the photonic, semiconductor and communication markets.

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