About Applied Thin-Film Products
ATP offers build-to-print service for a wide range of materials and metalization schemes. ATP fabricates circuits on substrates from Asfired Alumina to Beryllium to Fused Silica, even Silicon. Metalizations range from the standard Tan/TiW/Au to films including Nickel, Palladium, or Titanium. Circuit features can include fine pitch conductors, integrated resistors, vias, wraparounds, double-sided pattering, and air-bridges.