Electronic Packaging

Available from Kyocera America, Inc.
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Kyocera America, Inc. (KAI) has been manufacturing ceramic packages in San Diego, CA since 1971. KAI offers an extensive array of semiconductor packages and complex modules for numerous applications including RF, millimeter wave, high-reliability, phased array radar, and telecommunications. Packages are available in HTCC, LTCC, alumina, and BeO. KAI has state-of-the-art package design capability in-house that includes electrical and thermo-mechanical design, modeling / simulation and analysis to maximize package and circuit performance in your application. Our Assembly Technology Division accepts prototype to volume production orders for flip chip, wirebond, wafer dicing and vacuum soldering to provide a convenient one-stop-shop solution for customers.

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