fastRise(TM)
Multilayer non-reinforced prepreg designed to eliminate skew in differential transmission lines and eliminate Dk fluctuations caused by fiberglass in filter and coupler applications. fR-27 is a low temperature alternative to thermoplastic films in military designs.
TSM-DS
TSM-DS is a thermally stable, industry leading low loss core that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. Other features of this dimensionally stable laminate include industry best Df at .0010 @ 10 GHz, low (~5%) fiberglass content,...
fastFilm Laser Ablatable Chip Packaging Substrate
fastFilm 29 is a thin, laser ablatable substrate consisting of PTFE and a high concentration of ceramic. The very low 20 ppm/C Z axis expansion creates a reliable substrate for chip packaging. This non-reinforced core material is very homogeneous and suited for RF and digital applications which are...
TLY Family of Low Loss Laminates
TLY laminates are manufactured from very lightweight woven fiberglass and are much more dimensionally stable than non-reinforced PTFE composites. The woven matrix yields a more mechanically stable laminate that is suitable for high volume manufacturing and the low Df enables successful deployment...
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