Wireless&RF_TLB_8.1.20

Taconic

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136 Coonbrook Road
Petersburgh, NY 12138-4303

About Taconic

  • Taconic offers a wide range of high frequency laminates and prepregs used for fabrication of antennas, multilayer RF and high speed digital boards, interconnections and devices. Unique materials include low-loss prepregs, microwave laminates designed for low moisture and solvent resistance to enhance performance in difficult environments, and low-loss flexible laminates.
Competitors of Taconic
  • Lapping & polishing of ceramics & metals for the entire microelectronic industries. Materials include, AlN, Alumina, BeO, Fused Silica, Sapphire,and other dielectric materials. Centerline will lap & polish customer supplied Steel, Aluminum, Brass and other metals.
  • Goodfellow USA supplies a comprehensive range of Metals, Alloys, Ceramics, Polymers, Compounds, and Composites to the research and industrial markets. They are available in an extensive range of forms including sheets, foils, films, lump, powder, rods, wires, and tubes. We also offer larger...
  • Precision grinding services of ceramic materials including ferrite, quartz, glass, aluminum oxide, and silicon carbide. 100% quality and on time. Quartz Crystals, Ferrite Junctions, Quartz and Ceramic Pressure Windows, Alumina tuner rods, Isolator and Circulator Elements, Passive...

Products by Taconic

  • fastRise(TM)

    Multilayer non-reinforced prepreg designed to eliminate skew in differential transmission lines and eliminate Dk fluctuations caused by fiberglass in filter and coupler applications. fR-27 is a low temperature alternative to thermoplastic films in military designs. Read more
  • TSM-DS

    TSM-DS is a thermally stable, industry leading low loss core that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. Other features of this dimensionally stable laminate include industry best Df at .0010 @ 10 GHz, low (~5%) fiberglass content,... Read more
  • fastFilm Laser Ablatable Chip Packaging Substrate

    fastFilm 29 is a thin, laser ablatable substrate consisting of PTFE and a high concentration of ceramic. The very low 20 ppm/C Z axis expansion creates a reliable substrate for chip packaging. This non-reinforced core material is very homogeneous and suited for RF and digital applications which... Read more