Wireless&RF_TLB_8.1.20
 

Taconic

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136 Coonbrook Road
Petersburgh, NY 12138-4303
About Taconic
  • Taconic offers a wide range of high frequency laminates and prepregs used for fabrication of antennas, multilayer RF and high speed digital boards, interconnections and devices. Unique materials include low-loss prepregs, microwave laminates designed for low moisture and solvent resistance to enhance performance in difficult environments, and low-loss flexible laminates.
Competitors of Taconic

  • Centerline Technologies

    Lapping & polishing of ceramics & metals for the entire microelectronic industries. Materials include, AlN, Alumina, BeO, Fused Silica, Sapphire,and other dielectric materials. Centerline will lap & polish customer supplied Steel, Aluminum, Brass and other metals.

  • Goodfellow Corp.

    Goodfellow USA supplies a comprehensive range of Metals, Alloys, Ceramics, Polymers, Compounds, and Composites to the research and industrial markets. They are available in an extensive range of forms including sheets, foils, films, lump, powder, rods, wires, and tubes. We also offer larger...

  • Anderson & Steinssen Inc.

    Anderson & Steinssen, Inc (Abbreviation: ANS), was founded in 2016 and is located in Renton, Washington, USA. Our personnel have more than 20 years’ experience in the chemical industry, working with functional additives, high purity and ultra-pure chemicals, micron and nanomaterials and certain...
Products by Taconic

  • fastRise(TM)

    Multilayer non-reinforced prepreg designed to eliminate skew in differential transmission lines and eliminate Dk fluctuations caused by fiberglass in filter and coupler applications. fR-27 is a low temperature alternative to thermoplastic films in military designs. Read more

  • TSM-DS

    TSM-DS is a thermally stable, industry leading low loss core that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. Other features of this dimensionally stable laminate include industry best Df at .0010 @ 10 GHz, low (~5%) fiberglass content,... Read more

  • fastFilm Laser Ablatable Chip Packaging Substrate

    fastFilm 29 is a thin, laser ablatable substrate consisting of PTFE and a high concentration of ceramic. The very low 20 ppm/C Z axis expansion creates a reliable substrate for chip packaging. This non-reinforced core material is very homogeneous and suited for RF and digital applications which... Read more
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WirelessandRF_MedRec_1.10.19
Wireless&RF_3:1_8.10.20