fastFilm Laser Ablatable Chip Packaging Substrate

fastFilm Laser Ablatable Chip Packaging Substrate

fastFilm 29 is a thin, laser ablatable substrate consisting of PTFE and a high concentration of ceramic. The very low 20 ppm/C Z axis expansion creates a reliable substrate for chip packaging. This non-reinforced core material is very homogeneous and suited for RF and digital applications which are sensitive to Dk inconsistences where phase and skew are important.