Lapping & polishing of ceramics & metals for the entire microelectronic industries. Materials include, AlN, Alumina, BeO, Fused Silica, Sapphire,and other dielectric materials. Centerline will lap & polish customer supplied Steel, Aluminum, Brass and other metals.
Arlon Microwave Materials specializes in microwave circuit board materials made from fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, ceramic-filled hydrocarbon thermosets, and other materials that deliver the electrical performance needed in frequency-dependent circuit applications....
Dexter is the recognized leader in magnetic solutions for medical applications. Our 15+ years of experience serving the medical market gives us the knowledge needed to understand the highly specialized requirements manufacturers face in gaining FDA or CE approval. Our patented LifeSep™...
Precision grinding services of ceramic materials including ferrite, quartz, glass, aluminum oxide, and silicon carbide. 100% quality and on time. Quartz Crystals, Ferrite Junctions, Quartz and Ceramic Pressure Windows, Alumina tuner rods, Isolator and Circulator Elements, Passive...
High purity metal powders, compounds and fine chemicals. Stocked for innediate shipment.
We offer design, prototyping and full scale manufacturing for all types of hermetic seals. We specialize in ceramic to metal and sapphire to metal seals. Our products include ceramic packages, optical windows, waveguide components, hermetically sealed brazed or welded components, glass to metal...
MCV-Microwave is a leader in design and manufacture of high performance custom filter solutions for out-of-band emission interference mitigation and 4G and 5G new radio antenna front-end modules. MCV proprietary dielectric resonators exhibit the highest Q x F performance with tight tolerance,...
Anderson & Steinssen, Inc (Abbreviation: ANS), was founded in 2016 and is located in Renton, Washington, USA. Our personnel have more than 20 years’ experience in the chemical industry, working with functional additives, high purity and ultra-pure chemicals, micron and nanomaterials and certain...
fastFilm Laser Ablatable Chip Packaging Substrate: fastFilm 29 is a thin, laser ablatable substrate consisting of PTFE and a high concentration of ceramic. The very low 20 ppm/C Z axis expansion creates a reliable substrate for chip packaging. This non-reinforced core material is very homogeneous and suited for RF and digital applications which...
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